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Patent Searching and Data


Title:
SLIT DIE
Document Type and Number:
Japanese Patent JP2023148939
Kind Code:
A
Abstract:
To provide a slit die capable of making a shape in a width direction of a coating film formed in a stripe shape in the width direction more uniform than a conventional one.SOLUTION: A slit die for applying coating liquid to a substrate includes: a manifold as a space formed long in a width direction of the substrate and storing coating liquid; a plurality of supply ports disposed in the manifold so as to be aligned in the width direction and supplying the coating liquid to the manifold; a long slit in the width direction connected to the manifold; a discharge port for discharging the coating liquid from the manifold via the slit; a shim for dividing the slit into a plurality of spaces in the width direction to form small slits; and a division part for dividing the manifold into a plurality of spaces in the width direction to form small manifolds. The division part is arranged at a position of dividing the manifold so that at least the one supply port is positioned in each small manifold, and the one small manifold is connected to the one small slit.SELECTED DRAWING: Figure 2

Inventors:
MAEDA KAZUNORI
WATANABE ATSUSHI
Application Number:
JP2022057234A
Publication Date:
October 13, 2023
Filing Date:
March 30, 2022
Export Citation:
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Assignee:
TORAY ENG CO LTD
International Classes:
B05C5/02