Title:
SLURRY-DENSITY ADJUSTING DEVICE
Document Type and Number:
Japanese Patent JP2001173359
Kind Code:
A
Abstract:
To provide a simple slurry-density adjusting device capable of easily adjusting density rapidly.
The slurry-density adjusting device has the first slurry tank 1, the second slurry tank 2 in which a fluid is communicated movably with the first slurry tank 1, a water-level elevating means 3 elevating a water level in the second slurry tank 2 by sucking a gas or the liquid in the second slurry tank 2, a soil-sand supply means 4 supplying the inside of the first slurry tank 1 with soil and sand and a screen means 7 passing only slurry containing soil and sand having fixed grain size or less existing in the first slurry tank 1 through the second slurry tank 2.
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Inventors:
SUKEGAWA TEI
Application Number:
JP35838599A
Publication Date:
June 26, 2001
Filing Date:
December 17, 1999
Export Citation:
Assignee:
KOGENSHA KK
International Classes:
E21B21/06; (IPC1-7): E21B21/06
Attorney, Agent or Firm:
Toshio Ueda (1 person outside)
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