To provide slurry, a grindstone, a pad and abrasive fluid for mirror polishing of a silicon wafer, and a polishing method for the silicon wafer using these materials, by which a mirror polishing speed is remarkably improved, a mirror finished surface is obtained for a short time and a throughput is further improved.

The slurry, the grindstone, the pad and the abrasive fluid for mirror polishing of the silicon wafer are constituted so that fine grains of an alkali earth metal carbonate as abrasive grains may contain a water-soluble carbonate as an abrasive accelerator. In the polishing method of the silicon wafer, the fine grains of the alkali earth metal carbonate is used as the abrasive grains, and wet polishing is carried out in the presence of water and the water- soluble carbonate.