Title:
スラリ、研磨液の製造方法、及び、研磨方法
Document Type and Number:
Japanese Patent JP6965998
Kind Code:
B2
Abstract:
A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, a particle size of the second particles is smaller than a particle size of the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and in a case where a content of the abrasive grains is 0.1% by mass, an absorbance for light having a wavelength of 380 nm in a liquid phase obtained when the slurry is subjected to centrifugal separation for 5 minutes at a centrifugal acceleration of 5.8×104 G exceeds 0.
Inventors:
Tomomi Kukita
Tomohiro Iwano
Takamoto Matsumoto
Tomoyasu Hasegawa
Tomohiro Iwano
Takamoto Matsumoto
Tomoyasu Hasegawa
Application Number:
JP2020532132A
Publication Date:
November 10, 2021
Filing Date:
September 25, 2018
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
H01L21/304; B24B37/00; C01F17/235; C09G1/02; C09K3/14
Domestic Patent References:
| JP2017203076A | ||||
| JP2017117894A |
Foreign References:
| WO2018012174A1 | ||||
| WO2014208414A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Tomoya Furoshita
Yoshinori Shimizu
Hiroyuki Hirano
Tomoya Furoshita
Previous Patent: Slurry, polishing liquid manufacturing method, and polishing method
Next Patent: Slurry and polishing method
Next Patent: Slurry and polishing method