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Patent Searching and Data


Title:
SOCKET DEVICE AND LEAD WIRE CONNECTING METHOD FOR SOCKET DEVICE
Document Type and Number:
Japanese Patent JP2003346939
Kind Code:
A
Abstract:

To secure a conduction state by press-contacting a lead wire 5 and a terminal, though a structure is simple.

A socket body 2 is provided with a plurality of terminals, and the lead wires 5 for connecting the terminals. Each terminal is configurated by an external connecting terminal 3 fixed to one end part of the lead wire 5, and a pressure-contact terminal 4 of which a coating part 29 is torn by press- fitting the other end part of the lead wire 5 to be conducted to a core wire 28. The socket body 2 is provided with guide parts 14, 16 kept into contact with the coating part 29 of the lead wire 5 to reduce the load to a fixing part 21 to the external connecting terminal 3, when the lead wire 5 is press-fit to the pressure-contact terminal 4.


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Inventors:
OTSUKA HIROYUKI
DAITO HIROYUKI
TAKAHASHI KOSUKE
TASHIRO MASAHIKO
Application Number:
JP2002152867A
Publication Date:
December 05, 2003
Filing Date:
May 27, 2002
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
H01R4/24; H01R9/00; H01R9/24; (IPC1-7): H01R9/00; H01R4/24
Attorney, Agent or Firm:
Kaoru Aoyama (4 people outside)