To provide a solder adsorption machine for obtaining a strong adsorption force even if the machine has a dimension of the same level as the conventional one.

This solder adsorption machine comprises a pump base part 23 for constituting a diaphragm type vacuum pump 6, and a diaphragm 5 to be attached to the pump base part 23 in a way to form a space 24, whose capacity can vary and which is linked to adsorb/exhaust passages 11, 22 between the pump base part 23 and the diaphragm 5. In this case, an inclined part 32 molded along a shape of the diaphragm 5 is provided to a pump intermediate member 29 to be inserted in the diaphragm 5 of the pump base part 23, in a manner to abut on the diaphragm 5 when the air is exhausted from the vacuum pump 6. Then, the diaphragm 5 is molded into such a shape that a bottom is dented towards the pump base part 23.