Title:
SOLDER ALLOY FOR SOLDERING TO ELECTROLESS Ni PLATED PART
Document Type and Number:
Japanese Patent JP3682654
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that, though soldering has heretofore been performed with a solder alloy having a composition in the vicinity of an Sn-Pb eutectic in a BGA (Ball Grid Array) substrate and a printed circuit board coated with electroless Ni plating, if electric appliances incorporated with these substrates or the like are subjected to strong impact, the soldered parts are easily peeled.
SOLUTION: The solder alloy has resistance to peeling when a soldering part subjected to electroless Ni plating is soldered, and is composed by adding, by mass, 0.002 to 0.01% P and 0.04 to 0.3% Cu to a solder alloy having a composition in the vicinity of an Sn-Pb eutectic comprising 60 to 64% Sn, and the balance Pb.
More Like This:
Inventors:
Nozawa Iwao
Takashi Hori
Daisuke Souma
Takahiro Roppongi
Takashi Hori
Daisuke Souma
Takahiro Roppongi
Application Number:
JP2002278476A
Publication Date:
August 10, 2005
Filing Date:
September 25, 2002
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
B23K1/00; B23K35/02; B23K35/26; B23K35/24; B32B15/01; C22C13/00; H01L23/12; H05K3/34; H05K3/24; (IPC1-7): B23K35/26; C22C13/00; H01L23/12
Domestic Patent References:
| JP7195189A | ||||
| JP11000791A | ||||
| JP4267009A | ||||
| JP2001274275A |
Foreign References:
| US6307160 |
Other References:
苅谷ら,無電解Ni-Pめっき/銅含有はんだ界面におけるP-RICH反応相形成に及ぼす銅の効果,日本金属学会講演概要,日本,2004年 3月28日,Vol.130th, P.143