Title:
SOLDER ALLOY AND TARGET STRUCTURAL BODY
Document Type and Number:
Japanese Patent JPH07227690
Kind Code:
A
Abstract:
PURPOSE: To lessen the warpage of a backing plate and to prevent the crack of a sputtering target as joining of the target and the backing plate at a low temp. is feasible and to improve the joinability as the oxidation of Cu of a ground surface layer is drastically lessened.
CONSTITUTION: This solder alloy 2 consists of 30 to 60wt.% In, 30 to 60wt.% Sn and 0.1 to 10wt.% Zn. This sputtering target 1 is joined by using the solder alloy 2.
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Inventors:
NAKAGAMA SUSUMU
HAYASHI ATSUSHI
WATANABE FUMINORI
HAYASHI ATSUSHI
WATANABE FUMINORI
Application Number:
JP2284594A
Publication Date:
August 29, 1995
Filing Date:
February 21, 1994
Export Citation:
Assignee:
ASAHI GLASS CO LTD
International Classes:
B23K35/26; C22C13/00; C22C28/00; C23C14/34; (IPC1-7): B23K35/26; C22C13/00; C22C28/00; C23C14/34
Attorney, Agent or Firm:
Kenji Izumina
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