PURPOSE: To improve the heat resistance and adhesive strength of a solder alloy by incorporating respectively specific weight % of Ag, Sb into the alloy and controlling the content of either or both in total of Pb and Sn to prescribed %.
CONSTITUTION: The solder alloy consisting of Ag, Sb and either 1 or 2 kinds of Pb and Sn contains 30W70% Ag and 20W50% Sb and 5W40% either or both in total of Pb and Sn are incorporated therein to constitute the high melting point solder. Ag, Sb, Pb, and Sn are respectively independently compounded to a desired compsn. and such compsn. is melted and cast in the atm. in an electric furnace, etc., using a carbon crucible. The components Pb and Sn improve the wettability with Cu, Cu alloy, etc., and improve the adhesive strength of the solder. The components Ag and Sb improve the workability and increase the m.p., The heat resistance and adhesive strength of the solder alloy are thus improved by the above-mentioned method.
KOSUGI KEIZO
KIKUCHI SUKEYUKI
SHIROYAMA KAISUKE
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