Title:
はんだ組成物
Document Type and Number:
Japanese Patent JP6912519
Kind Code:
B2
Abstract:
A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
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Inventors:
Morgana de Avila Hibas
Dominic Lodge
Ranjit panda
Bawa Shin
Ravindra M. Batkar
Raful Laut
Siuri Circer
Camanio Chat Padiya
Proroy Nadi
Dominic Lodge
Ranjit panda
Bawa Shin
Ravindra M. Batkar
Raful Laut
Siuri Circer
Camanio Chat Padiya
Proroy Nadi
Application Number:
JP2019104821A
Publication Date:
August 04, 2021
Filing Date:
June 04, 2019
Export Citation:
Assignee:
ALPHA ASSEMBLY SOLUTIONS INC.
International Classes:
B23K35/22; B22F1/107; B22F1/12; B23K35/14; B23K35/26; C22C12/00; C22C13/00
Domestic Patent References:
| JP2010129664A | ||||
| JP2008300342A |
Foreign References:
| WO2011055887A1 |
Attorney, Agent or Firm:
Norihito Yamao
Noriko Cauldron
Noriko Cauldron