PURPOSE: To carry out solder dip treatment effectively in proper quantities by providing a vertical slit to a block body of good wettability against molten solder to lead the molten solder to a higher position than a level thereof and by providing a flow path of a treated electronic part to a top face of the block body.
CONSTITUTION: A block body 4 consists of a metal such as iron or nickel which has good wettability against a molten solder 1 consisting of an eutectic alloy of lead and zinc. A vertical slit 5 is provided to the block body 4 to lead the molten solder 1 to a higher position than a level thereof. The slit 5 reaches a top face of the block body 4. A flow path of a treated electronic part is provided to the top face of the block body 4. Since the treated electronic part 7 is held between both belts 8, 9 at a frame section 6a of one side edge, a frame section 6b of the other side edge faces down. While the part 7 passes through inside the vertical slit 5 of the block body 4, dip treatment is carried out.
FUKUDA YOSHINOBU
ARAI KOICHI
SASANUMA OSAMU
| JPS63278666A | 1988-11-16 | |||
| JPS6059761A | 1985-04-06 |
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