Title:
はんだホルダおよび自動はんだ付け装置
Document Type and Number:
Japanese Patent JP7123352
Kind Code:
B2
Abstract:
To make it possible to keep time of variation until a ball solder reaches a tip of a solder holder and to increase soldering accuracy and production speed.SOLUTION: A solder holder 26, which is located at a tip of a soldering device, is so configured as to have a conical hole so that an inner diameter thereof becomes smaller as approaching a tip. On a wall part 26c in which the conical hole of the solder holder is formed, at least one rib 26d, which linearly extends from a bottom toward a tip and has a prescribed height, is provided. A ball solder is caused to linearly drop from a bottom surface 26a of the solder holder toward the tip part along the rib.SELECTED DRAWING: Figure 1
Inventors:
Koji Maruyama
Shigeru Tadama
Shigeru Tadama
Application Number:
JP2019222004A
Publication Date:
August 23, 2022
Filing Date:
December 09, 2019
Export Citation:
Assignee:
Horiuchi Electric Manufacturing Co., Ltd.
International Classes:
B23K3/06; B23K1/005
Domestic Patent References:
| JP1170669A | ||||
| JP201036947A |
Foreign References:
| WO2019065065A1 | ||||
| US20160258685 |
Attorney, Agent or Firm:
Shinto International Patent Office