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Patent Searching and Data


Title:
SOLDER LIQUID LEVEL CONTROL APPARATUS AND METHOD
Document Type and Number:
Japanese Patent JP2008238237
Kind Code:
A
Abstract:

To provide a solder liquid level control apparatus that can quickly supply solder for a shortage and that has excellent usability.

The solder liquid level control apparatus is equipped with a pair of electrodes 16 connected to a detection circuit, in a freely vertically operated manner. A driving source for the vertical operation is a servo motor 25. An encoder 24 for controllably driving the servo motor 25 is monitored, conduction when the electrodes 16 descend to come in contact with the liquid level of a solder vessel 17 is detected, thus from the value of the encoder 24 when the conduction is detected, the liquid level height of the solder vessel 17 is detected, a difference is obtained between a preset/input liquid level and the detected liquid level height. A controller 20 is provided which supplies an amount of solder 18 corresponding to this difference to the solder vessel 17 by a solder feeding means 26.


Inventors:
SHIMADA MINORU
INOUE HIROYUKI
Application Number:
JP2007085067A
Publication Date:
October 09, 2008
Filing Date:
March 28, 2007
Export Citation:
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Assignee:
SHIN MEIWA IND CO LTD
International Classes:
B23K3/06; G01F23/24; G05D9/12; B23K101/38
Attorney, Agent or Firm:
Shigeaki Yoshida
Yoshitake Hidetoshi
Takahiro Arita