SOLDER MATERIAL SEPARATING DEVICE AND METHOD OF SEPARATING SOLDER MATERIAL BY USING THE SAME

Title:

SOLDER MATERIAL SEPARATING DEVICE AND METHOD OF SEPARATING SOLDER MATERIAL BY USING THE SAME

Document Type and Number:

Japanese Patent JP2010175095

Kind Code:

A

Abstract:

To provide a solder material separating device capable of separating solder from used cream solder.

This solder material separating device for melting a solder material in a tank, and taking out flux and solidified solder separated by slow cooling to the outside of the tank, includes a separation tank in which the solder material including the solder and the flux, is charged, a supporting mechanism for rotatably or tiltably supporting the separation tank, a drive controlling mechanism for rotating or tilting the separation tank, and stopping the same at a prescribed rotating or tilting angle from its upward attitude, a heating means for heating the separation tank for melting the solder material in the tank, and a temperature controlling mechanism capable of keeping a temperature in the separation tank at a high temperature lower than a melting point of the solder.

Inventors:

ADACHI YASUHIRO
YAMAZAKI MASAAKI

Application Number:

JP2009015979A

Publication Date:

August 12, 2010

Filing Date:

January 27, 2009

Export Citation:

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Assignee:

RICOH MICROELECTRONICS CO LTD
SEITEC CO LTD
SEIKA SANGYO CO LTD

International Classes:

F27B17/00; C22B7/00; F27D3/15; F27D19/00; F27D21/00; H05K3/34

Domestic Patent References:

JP2007224346A	2007-09-06
JP2004043972A	2004-02-12
JPS60228625A	1985-11-13

Attorney, Agent or Firm:

Calyx
Miyazaki Yoshio
Tsutomu Kato
Kyoko Oyama
Kaoru Onozuka
Akio Tagami
High Masahiro
Norio Mori
Seiji Yamada

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