Title:
半田用ノズル
Document Type and Number:
Japanese Patent JP3601141
Kind Code:
B2
Abstract:
A nozzle is able to reliably coat and solder a paste-like solder onto a joined member to be soldered, e.g., a plurality of surfaces of two surfaces or more including a joined corner of a metal plate and a base. In a nozzle (1A) according to the present invention, an inner wall length of a tip end portion (4) of a pipe forming a nozzle body (2) is selected such that one side portion (4A) side is reduced in length and an opposite portion (4B) side opposing the one side portion (4A) side is increased in length and an outlet (5) with a sunken opening (5A) is formed at the tip end portion (4) by progressively approaching an inner wall surface (4b) of the other side portion (4B) side to an inner wall surface (4a) of the one side portion (4A) side. Thus, a paste-like solder (S) to be escaped flows in an oblique direction different from the direction in which a fluid guided by the nozzle body (2) portion flows.
Inventors:
Tsurusaki Shin
Application Number:
JP31053495A
Publication Date:
December 15, 2004
Filing Date:
November 29, 1995
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B05B1/02; B23K3/08; H05K3/34; (IPC1-7): B05B1/02; H05K3/34
Domestic Patent References:
| JP60104239U | ||||
| JP52049371U | ||||
| JP59145032U |
Attorney, Agent or Firm:
Mitsuo Takahashi