Title:
SOLDER PASTE COMPOSITION
Document Type and Number:
Japanese Patent JP2005152999
Kind Code:
A
Abstract:
To provide a leadless type solder paste which prevents the characteristics of solderability from being degraded by improving the wettability with plated surfaces of a printed circuit board subjected to nickel plating particularly on soldered lands and with the nickel plated components.
The solder paste composition contains a high molecular weight amine-based compound in the solder paste which contains at least leadless-based solder powder and a resin component and is used at the time of soldering electronic components to the circuit board.
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Inventors:
KITATSUME TAKAHIRO
ONO TAKAO
TAKAHASHI YOSHIYUKI
IWABUCHI MITSURU
ONO TAKAO
TAKAHASHI YOSHIYUKI
IWABUCHI MITSURU
Application Number:
JP2003398954A
Publication Date:
June 16, 2005
Filing Date:
November 28, 2003
Export Citation:
Assignee:
TAMURA KAKEN CO LTD
International Classes:
B23K35/363; C08K3/08; C08L79/02; C08L93/04; H05K3/34; (IPC1-7): B23K35/363; C08K3/08; C08L79/02; C08L93/04; H05K3/34
Attorney, Agent or Firm:
Tadashi Sano
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