Title:
SOLDER PASTE PRINTER AND CONTROLLING METHOD THEREFOR
Document Type and Number:
Japanese Patent JPH09174808
Kind Code:
A
Abstract:
To prevent the wear of a squeegee by making it possible to correspond to the undulation change of an object to be printed and making the printing thickness uniform.
The solder paste printer 11 comprises a plate 16 placed on a base plate 14 and having a printing pattern-like opening 15, and a squeegee 13 moving along the surface of the plate 16 to coat the opening 15 with solder paste S to solder a component onto the pattern on the plate 14, thereby printing the paste S for soldering the component. Strain gages 11, 18 are laminated on the surface of a squeegee holder 12 or the squeegee 13.
Inventors:
YAMAGUCHI MINORU
Application Number:
JP35064295A
Publication Date:
July 08, 1997
Filing Date:
December 22, 1995
Export Citation:
Assignee:
SONY CORP
International Classes:
B41F15/08; B41F15/40; H05K3/12; H05K3/34; (IPC1-7): B41F15/40; B41F15/08; H05K3/34
Attorney, Agent or Firm:
Oka-saki-Shintaro (1 person outside)