Title:
SOLDER PASTE, SOLDERING METHOD, AND SURFACE-MOUNTING TYPE ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP3785435
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To maintain the insulation property and the wettability of a specified level even when an additive to improve the printability is added.
SOLUTION: A solder paste is applied to electrodes 2, 3 on an upper surface of a ceramic substrate 1. The solder paste contains a metallic powder, an organic acid, and an alcohol having ≥2 OH radicals. Electronic parts 6 to be mounted are arranged on the ceramic substrate 1, and electrodes (bumps) of the electronic parts 6 are brought into contact with the paste. The electronic parts are placed in a reflow furnace to effect the solder reflow in a nitrogen atmosphere. The electrodes 2, 3 and the electronic parts 6 in the wiring pattern are joined with each other with solders 9, 10. Ester films 11, 12, 13, 14 are generated around the electrodes 2, 3 on the ceramic substrate 1, and high insulation reliability is ensured by the ester films 11, 12, 13, 14.
Inventors:
Akira Tanahashi
Norihisa Imaizumi
Seiji Shibata
Eiichi Sudo
Norihisa Imaizumi
Seiji Shibata
Eiichi Sudo
Application Number:
JP24186398A
Publication Date:
June 14, 2006
Filing Date:
August 27, 1998
Export Citation:
Assignee:
株式会社デンソー
タムラ化研株式会社
タムラ化研株式会社
International Classes:
B23K35/22; B23K35/363; B23K35/02; B23K35/36; H05K3/34; B23K35/26; (IPC1-7): B23K35/363; B23K35/22; H05K3/34
Domestic Patent References:
| JP2290693A | ||||
| JP7236991A | ||||
| JP9094691A | ||||
| JP5008085A | ||||
| JP7314180A | ||||
| JP6502126A |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Makoto Onda
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