Title:
SOLDER POWDER AND ITS PRODUCTION METHOD, SOLDER PASTE USING THE SOLDER POWDER
Document Type and Number:
Japanese Patent JP3493101
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide solder powder to suppress generation of a solder ball, its production method and a solder paste with using the solder powder by suppressing surface oxidation of the solder powder to suppress generation of the solder ball in a reflow process, specifically, during storing of the solder powder, protecting the surface of the solder powder in all processes of a pasting process to make the solder powder into a paste, a printing process, a transfer process to a reflow furnace, a reflow process, etc., and extremely suppressing oxidation of the solder powder in each process.
SOLUTION: The solder powder, which is formed with an organic metal compound between an adipic acid and a metal in a solder alloy, is used. The solder powder is produced by reacting the solder alloy powder to a vaporized adipic acid. The solder alloy powder, in which an organic metal compound of an adipic acid is formed in chemical bonding to the surface of the solder alloy powder, is kneaded with a flux and a solvent to be formed into a solder paste.
Inventors:
Kenzo Hanawa
Takayuki Araki
Yoshiyasu Okamura
Yasuhiro Asano
Takayuki Araki
Yoshiyasu Okamura
Yasuhiro Asano
Application Number:
JP23363396A
Publication Date:
February 03, 2004
Filing Date:
August 15, 1996
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
Nippon Alpha Metals Co., Ltd.
Nippon Alpha Metals Co., Ltd.
International Classes:
B22F1/02; B23K35/02; B23K35/14; B23K35/36; B23K35/22; B23K35/363; B23K35/40; C07C55/14; H05K3/34; B23K35/26; (IPC1-7): B23K35/40; B23K35/22; B23K35/363
Domestic Patent References:
| JP5752588A | ||||
| JP5337687A | ||||
| JP4251691A | ||||
| JP4111993A |
Attorney, Agent or Firm:
Eiji Tomomatsu