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Title:
SOLDER REMOVING EQUIPMENT
Document Type and Number:
Japanese Patent JPH06246437
Kind Code:
A
Abstract:

PURPOSE: To provide a solder removing equipment which can constantly contain appropriate amount of water or other cooling liquid for a friction member without requesting complicated operations in the solder removing equipment using the friction member.

CONSTITUTION: In an equipment where the solder attached to soldering tools A, B is rubbed off by a friction member while the solder is cooled, a storing part 12 of the cooling liquid 20, a rotary cylindrical body 30 where a liquid- absorbing friction member 40 is provided along the inner circumferential surface and which has penetrated parts 32, 33 in the circumferential wall, and a scraping-up member 50 which is integratedly rotated with the rotary cylindrical body 30, scrapes up the cooling liquid 20 of the storing part 12, and supplies the scraped-up cooling liquid 20 to the penetrated parts 32, 33 of the rotary cylindrical body 30 are provided. This constitution automatically supplies the cooling liquid 20 of appropriate amount from the penetrated parts 32, 33 to the liquid-absorbing friction member 40.


Inventors:
KISHIOKA TAKASHI
Application Number:
JP3903993A
Publication Date:
September 06, 1994
Filing Date:
February 26, 1993
Export Citation:
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Assignee:
FUJI INDUSTRIES CO LTD
KISHIOKA TAKASHI
International Classes:
B23K3/02; (IPC1-7): B23K3/02
Domestic Patent References:
JP59175469B
JPH021565B21990-01-12
JP4108962B22008-06-25
Attorney, Agent or Firm:
Takehiko Matsumoto