Title:
SOLDER RESIST, FORMING METHOD THEREOF, AND SOLDER SUPPLY METHOD
Document Type and Number:
Japanese Patent JP3699980
Kind Code:
B2
Abstract:
PURPOSE: To enable a solder coat to be optionally controlled in thickness by a method wherein the inner wall of an opening is terraced.
CONSTITUTION: The inner wall of an opening 14A provided to a solder resist 14 is terraced, and the upper stepped parts 13A of the opening 14a are not more limited in size and shape than the lowest part 12A. Therefore, the stepped parts 13A which form the terraced opening 14A of the resist 14 are properly set in shape, whereby the opening 14A of the resist 14 is optionally set in volume as a whole. Therefore, solder fed to the solder supplying spot of a work 10 is capable of being controlled in volume, so that a solder coat formed on the solder supply spot 15 can be optionally controlled in thickness.
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Inventors:
Ito Mutsu
Hiroki Ogi
Hiroki Ogi
Application Number:
JP34051594A
Publication Date:
September 28, 2005
Filing Date:
December 28, 1994
Export Citation:
Assignee:
ソニー株式会社
デュポン株式会社
デュポン株式会社
International Classes:
H05K3/34; H01L21/321; H01L21/60; (IPC1-7): H05K3/34; H01L21/60
Domestic Patent References:
| JP5198928A | ||||
| JP6350230A | ||||
| JP61256789A | ||||
| JP4356994A |
Attorney, Agent or Firm:
Keiki Tanabe