Title:
SOLDER SPREAD PREVENTION FILM FOR METALLIC SURFACE, SURFACE TREATMENT LIQUID FOR FORMING THE SAME, AND USE OF SOLDER SPREAD PREVENTION FILM
Document Type and Number:
Japanese Patent JP2023162533
Kind Code:
A
Abstract:
To provide a solder spread prevention film which is excellent in compatibility with metal (especially, copper), heat resistance, and solder spread prevention property.SOLUTION: A solder spread prevention film contains an azole silane compound, wherein the azole silane compound is a compound having an azole ring and a silyl group, which can enhance interaction with metal (especially, copper). Heat resistance and solder spread prevention property are excellent by the mutual reaction of the azole silane compounds to cause dehydration condensation and siloxane bond (Si-O-Si) formation, as well as the complex formation of the azole silane compounds and metallic ions (especially, copper ions). A metallic surface formed with a solder spread prevention film containing the azole silane compounds can be expected to improve adhesion to a resin, for example, can be expected to improve adhesion between a metallic circuit of a printed wiring board and a metallic terminal of an electronic component, and a sealing resin (mold resin).SELECTED DRAWING: None
Inventors:
YAMACHI NORIAKI
MATSUURA SHUN
NAKANISHI MASATO
KATSUMURA MASATO
MATSUURA SHUN
NAKANISHI MASATO
KATSUMURA MASATO
Application Number:
JP2022072903A
Publication Date:
November 09, 2023
Filing Date:
April 27, 2022
Export Citation:
Assignee:
SHIKOKU CHEM
International Classes:
C09D201/00; C09D5/00; C09D7/63; C23C26/00; H05K3/28