Title:
SOLDER SUPPLYING METHOD
Document Type and Number:
Japanese Patent JPH06152117
Kind Code:
A
Abstract:
PURPOSE: To provide a method for supplying solder on a wiring board at ease and at low cost.
CONSTITUTION: Ultrafine particles of solder produced by an ultrafine particle film forming apparatus are sprayed on a circuit pattern 23 of a wiring board 21 in order to form a solder film 22. By scanning and shifting a nozzle 13 for blowing out ultrafine particles or the board 21, desired solder supplying points or desired pattern 23 can be coated with solder thereon.
Inventors:
FUJIKAWA MOTONARI
TANIGAMI MASANOBU
HIRANO MASAO
RI SOUGO
KONISHI GIICHI
NISHIMURA SADAMU
TANIGAMI MASANOBU
HIRANO MASAO
RI SOUGO
KONISHI GIICHI
NISHIMURA SADAMU
Application Number:
JP32738292A
Publication Date:
May 31, 1994
Filing Date:
November 11, 1992
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
H05K3/34; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Nakano Masafusa
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