Title:
SOLDER WIRE DELIVERY DEVICE
Document Type and Number:
Japanese Patent JP3287271
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To stably deliver a fine soldering wire by making a fine solder wire delivery rollers with a rubber which is softer than the soldering wire so that the soldering wire can be delivered without being crushed.
SOLUTION: The solder wire 1 is pulled out from a roll 2 and guided to the delivery rollers 3.3 via a solder wire cut detecting unit 5. The delivery rollers 3.3 rotate by a signal from a solder wire delivery controller 8 and, deliver the solder wire to the wire stick detecting unit 6. The solder wire 1 comes into a solder wire aiming position fine adjustment unit 9 via a delivery tube 7 to be guided to the soldering part after its aiming position is finely adjusted. Because the delivery rollers 3.3 made of rubber is softer than the solder wire 1, the solder wire 1 can be guided to the soldering part through the delivery tube 7 and the solder wire aiming position fine adjustment unit 9 without being crushed. As the cross-section face of the solder wire 1 is not changed, it does not stuck driving the course of delivery route.
Inventors:
River Saki Moriya
Masayoshi Ueda
Tamotsu Ikeda
Nobuyuki Haji
Masayoshi Ueda
Tamotsu Ikeda
Nobuyuki Haji
Application Number:
JP15632797A
Publication Date:
June 04, 2002
Filing Date:
June 13, 1997
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B65H51/10; B23K3/06; B65H63/024; (IPC1-7): B23K3/06; B65H51/10; B65H63/024
Domestic Patent References:
| JP5245627A | ||||
| JP825032A |
Other References:
【文献】登録実用新案3021886(JP,U)
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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