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Patent Searching and Data


Title:
SOLDERABILITY MEASURING DEVICE
Document Type and Number:
Japanese Patent JPH11145614
Kind Code:
A
Abstract:

To form a sample holding part into a comparatively simple constitution and to contrive reduction of the cost of the sample holding part, by a method wherein when a sample held by the sample holding part of a shaft member is put in contact with a molten solder, a force to act on the sample is detached.

A upward and downward displacement by a sample holding part 42 of a sample 55 is transferred to an elastic plate member 51 provided at a measuring part 50 via a shaft member 41 and a coupling member 45. Thereby, in the measuring part 50, detection of a force to generate the displacement of the member 51 by a transducer built in the measuring part 50 is conducted, and at the same time, a detection output signal SD to respond to the detected result is formed and the signal SD is led out between one pair of output terminals 53a and 53B as a solderability measuring output signal to the sample 55. As a result, the sample holding part is formed into a comparatively simple constitution and reduction of the cost of the sample holding part is contrived.


Inventors:
TSUCHIYA TAKASHI
Application Number:
JP31162497A
Publication Date:
May 28, 1999
Filing Date:
November 13, 1997
Export Citation:
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Assignee:
SONY CORP
International Classes:
G01L5/00; B23K1/00; B25B9/04; G01N13/02; H05K3/34; H05K13/00; (IPC1-7): H05K3/34; B23K1/00; B25B9/04; G01L5/00; G01N13/02; H05K13/00
Attorney, Agent or Firm:
Sadaaki Kambara