PURPOSE: To obtain the titled composition for printed circuit board, etc., having excellent heat-resistance, moisture-resistance, adhesivity, etc., by compounding brass powder, a specific cyanic acid ester-maleimide resin and a rosin at specific ratios.
CONSTITUTION: The objective composition is produced by compounding (A) 90W 97pts.wt. of brass powder (powder of copper-zinc alloy having particle diameter of ≤80μ), (B) 3W10pts.wt. of a cyanic acid ester-maleimide resin containing, as essential components, (i) a polyfunctional cyanic acid ester containing ≥2 cyanato groups in the molecule, a prepolymer of a cyanic acid ester, or a prepolymer of a cyanic acid ester and an amine and (ii) a polyfunctional maleimide containing ≥2 N-maleimide groups in the molecule, prepolymer of a maleimide or prepolymer of a maleimide and an amine, and (C) 1W9pts.wt. of a rosin.
OOSAKI YASUNARI
FURUYA YOSHIYUKI
| JPS5740857A | 1982-03-06 | |||
| JPS5430440A | 1979-03-06 | |||
| JPS5440573A | 1979-03-30 | |||
| JPS4955723A | 1974-05-30 |