To provide a soldering apparatus capable of enhancing maintainability, preventing occurrence of any defective soldering, and improving a product quality, and a method for manufacturing a lamp using the same.

The soldering apparatus 11 for soldering the lamp base 3 of a lamp includes a chuck for holding the lamp in a state that the eyelet part 5 of the lamp base 3 is upwardly directed, a blocking plate 16 arranged above the eyelet part 5, a through-hole 16a formed at the position corresponding to the eyelet part 5 of the blocking plate 16, a jet heater 15 for jetting high-temperature gas toward the through-hole 16a and its vicinity, and a solder feeder 14 for feeding solder 13 toward the eyelet part 5 from the upper side via the through-hole 16a.

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