Title:
SOLDERING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JPS60257971
Kind Code:
A
Abstract:
In the continuous production soldering of circuit boards (27) and other products, a vessel (10) is provided for containing a heated saturated inert vapour into which the product (27) is introduced prior to solder application. One or more nozzles (24, 26) are disposed within the vessel for directing one or more streams of molten solder to the heated product. After solder application, the product is subjected to a solder levelling or debridging operation by passage past one or more nozzles (32, 34) which direct streams of vapour phase condensate (14) onto the product surfaces. Each of the operations is separately controllable and is substantially independent of the control of the other operations of the overall system. The circuit boards are supported in frames moved by chains.
Inventors:
DONARUDO JIYOSEFU SUPIGARERI
DAGURASU JIYON PETSUKU
JIEIMUZU RII FUINEI
DAGURASU JIYON PETSUKU
JIEIMUZU RII FUINEI
Application Number:
JP11198385A
Publication Date:
December 19, 1985
Filing Date:
May 24, 1985
Export Citation:
Assignee:
EICHI TEI SHII CORP ZA
International Classes:
B23K1/00; B23K1/015; B23K3/06; H05K3/34; (IPC1-7): B23K3/00; B23K3/04; H05K3/34
Attorney, Agent or Firm:
Minoru Nakamura (7 outside)