PURPOSE: To prevent oxidation of the solder surface and to improve operability by providing a solder vessel and a nitrogen enriching device to enrich nitrogen in air space in this solder vessel and constituting a circulation system of the air space in the above-mentioned solder vessel and the nitrogen enriching device.
CONSTITUTION: The circulation system is constituted of the air space of the reflow type solder vessel 1 and the nitrogen enriching device 2 utilizing a gas transmission film or adsorption and desorption, etc., and nitrogen in the air is concentrated to manufacture nitrogen-enriched air. As long as the film and an adsorbent function, this can be used and the bomb exchange, high pressure gas handling, etc., are unnecessary. Consequently, the inside of the solder vessel can be easily formed into an inert atmosphere and oxidation of the solder surface is prevented or can be suppressed as much as possible. In addition, this is also very effective for the solder vessel of the present state including the solder vessel at the time of using flux corresponding to printed board non- cleaning estimated in the future.
OGASAWARA HIDEO
IRIOKA KAZUYOSHI
