Title:
半田付け装置及び方法
Document Type and Number:
Japanese Patent JP5498879
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a slip of solder or a solder ball around Ps in the soldering of a linear portion 36 (start end Ps and terminal end Pe) of a transparent electrode layer of a TCO substrate in a solar battery 12.SOLUTION: As an operation 1, an iron tip 24 of ultrasonic soldering iron 23 is moved from Ps to P3 toward the X-axial front side while being held at a close position. On this occasion, the iron is moved with supply (with the supply of a solder wire 29 to the iron tip 24) between Ps-P1 and without supply (without the supply of the solder wire 29 to the iron tip 24) between P1-P3. As an operation 2, the iron tip 24 is returned in the X-axial direction while being held at a separated position. As an operation 3, the iron tip 24 of the ultrasonic soldering iron 23 is moved from Ps to P5 toward the X-axial front side of the iron while being held again at the close position. On this occasion, the iron tip 24 is moved without supply between Ps-P2, with supply between P2-P4, and without supply between P4-Pe.
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Inventors:
Nojima Aki
Kuniyasu Ito
Tabata Kimihide
Hirofumi Mima
Naofumi Nagata
Kuniyasu Ito
Tabata Kimihide
Hirofumi Mima
Naofumi Nagata
Application Number:
JP2010157084A
Publication Date:
May 21, 2014
Filing Date:
July 09, 2010
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
B23K3/00; B23K1/00; B23K3/06; H01L31/042; B23K3/02; B23K101/38
Domestic Patent References:
| JP2001127322A | ||||
| JP11138255A | ||||
| JP7204838A | ||||
| JP52011146A | ||||
| JP43003799B1 | ||||
| JP8323467A |
Attorney, Agent or Firm:
Creation International Patent Office