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Title:
SOLDERING FLUX AND CREAM SOLDER
Document Type and Number:
Japanese Patent JP2006075875
Kind Code:
A
Abstract:

To provide cream solder having excellent solderability and storing stability.

A soldering flux contains, as an activator, a xylene derived compound in which bromine or chlorine is substituted for 2-6 hydrogen atoms among hydrogen atoms bonding to two methyl groups of xylene, and/or a toluene derived compound in which bromine or chlorine is substituted for 2-3 hydrogen atoms among hydrogen atoms bonding to the methyl group of toluene and in which bromine or chlorine is further substituted for 1-2 hydrogen atoms of a benzene ring.


Inventors:
TENJIN YOSHIO
OKAJI TOMIO
TAKIZAWA KATSUNORI
Application Number:
JP2004263284A
Publication Date:
March 23, 2006
Filing Date:
September 10, 2004
Export Citation:
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Assignee:
NIPPON HANDA KK
International Classes:
B23K35/363; B23K35/22; H05K3/34
Domestic Patent References:
JPH10175092A1998-06-30
JP2001138089A2001-05-22
JPH10175092A1998-06-30
JP2001138089A2001-05-22
Attorney, Agent or Firm:
Takehiko Saito
Yasuyuki Hata



 
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