Title:
SOLDERING FLUX
Document Type and Number:
Japanese Patent JP2003001487
Kind Code:
A
Abstract:
To provide soldering flux with which the reaction between solder metal and the flux on preservation is suppressed and which has high solderability, and satisfactory preservation stability.
The soldering flux contains a 1 to 50 mass% resin component containing a carboxylic group, and having a softening point ≤100°C, an organic amine having an acid dissociation constant (pKa) within the range 10.0 to 11.5, a boiling point within the range 50 to 200°C, a nonionic organic halogen compound, and pH as a whole lies within the range 4 to 9.
Inventors:
KUROZUMI TADATOSHI
NISHIOKA AYAKO
NISHIOKA AYAKO
Application Number:
JP2001181718A
Publication Date:
January 08, 2003
Filing Date:
June 15, 2001
Export Citation:
Assignee:
SHOWA DENKO KK
International Classes:
B23K1/00; B23K35/363; C08K5/00; C08K5/17; C08K5/3412; C08L93/04; C08L101/08; H05K1/18; H05K3/34; (IPC1-7): B23K35/363; C08K5/00; C08K5/17; C08K5/3412; C08L93/04; C08L101/08; H05K1/18; H05K3/34
Domestic Patent References:
| JP2001138089A | 2001-05-22 | |||
| JPH0639584A | 1994-02-15 | |||
| JP2001105180A | 2001-04-17 |
Foreign References:
| WO1999064199A1 | 1999-12-16 |
Attorney, Agent or Firm:
Kikuchi Seiichi