PURPOSE: To widen a dynamic range by omitting the absorption of X rays in lead pin parts of a soldering inspecting apparatus for inspecting a surface mounted parts which is not soldered yet.
CONSTITUTION: A semiconductor element 4 having a plurality of lead pins 41 is soldered and mounted on a board 5, and a mounted part 6 is obtained. In a soldering inspecting apparatus, X-ray beam is cast on the mounted part 6, and a soldered part 42 is inspected based on the transmitted X rays. The soldering inspecting apparatus has the constitution having the parts performing the following functions, respectively. An X-ray generating means 1 generates the X-ray beam 11. A positioning control means 2 controls the relative positions of the X-ray generating means 1 and the mounted part 6 so that the X-ray beam 11 is transmitted through a path in a gap between a plurality of the lead pins 41 with respect to the soldered part 42 of the mounted part 6. An X-ray detecting means 3 detects the intensity of the X-ray beam 11 which is transmitted through the soldered part of the mounted part 6. The suitability of the soldered part 42 is inspected based on the detected intensity of the rays.
ANDO MORITOSHI
IWATA SATOSHI
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