PURPOSE: To improve the quality of a surface packaging board by providing a shape measuring means which irradiates the board packaged with parts on the surface with electromagnetic waves and obtains the shape of the soldered parts at the lead ends of the parts and a soldering defect detecting means which detects soldering defects in accordance with the side surface shape thereof.
CONSTITUTION: The solder is pulled up by the lead 4 under the surface tension of the solder 5 at the time of melting the solder by heating. The side face of the solder is recessed and an inclination changes rapidly at the top end of the side face of the solder, i.e., the boundary between the solder and the lead if the soldering is good. The soldering defect is detected in accordance with the side face shape of the soldered part 5 largely reflecting the non- defectiveness and defectiveness of the soldering in such a manner and, therefore, the exact soldering inspection is executed. While the thickness over the entire part of the soldered part is known if X-rays are used, the soldering inspection by measuring optically the shape (height) in the side surface part of the solder is possible as well. Contribution is made to the improvement in the quality of the surface packaging board in this way.
ANDO MORITOSHI
IWATA SATOSHI
