Title:
半田鏝の鏝先及び半田付け装置
Document Type and Number:
Japanese Patent JP6703733
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a tip of a soldering iron capable of reducing the cleaning and replacing frequencies, and a soldering iron using the tip.SOLUTION: A tip 5 of a soldering iron comprises: a cylinder 50 having openings 511 and 512 at the front end and the rear end, and a solder hole 51 extending through in the axial direction; and a melting region 510 at an intermediate portion of the solder hole 51, for melting a solder piece Wh. An inert gas is fed to the solder hole 51 at least on the tip side of the melting region 510.SELECTED DRAWING: Figure 4
Inventors:
Mitsuo Ebisawa
Application Number:
JP2016000353A
Publication Date:
June 03, 2020
Filing Date:
January 05, 2016
Export Citation:
Assignee:
AND Co., Ltd.
International Classes:
B23K3/02; B23K3/06; B23K31/02; H05K3/34
Domestic Patent References:
| JP2053873U |
Foreign References:
| WO2008023461A1 | ||||
| US5878939 |
Attorney, Agent or Firm:
Shigeki Yamada