To effectively remove a solder bridge by using a soldering iron having tip end parts which are separated at a narrow interval nearly equal to or narrower than a lead interval of semiconductor electronic parts.

The soldering iron 1 is provided with an attachable and detachable iron tip 3 in the tip end of its handle. The solder tip 3 is provided with two separated fork end-like tip end parts 4a, 4b. The interval between the tip end parts 4a, 4b is nearly equal to or narrower then the lead interval of the electronic parts to be treated. Plural iron tips 3 having different intervals between the tip end parts 4a, 4b are previously prepared and preferably used matching the lead interval of the electronic parts to be treated. The iron bridge 8 is formed between the leads 6. The solder tip 3 is heated and touched the solder bridge 8. The solder bridge 8 is melted, sucked between the tip end parts 4a, 4b by surface tension and removed.