PURPOSE: To improve the bonding strength by uniformly and highly dispersing and attaching a bonding assistant component composed of Ti, Zr and/or Cr in a finely dispersed state to a solder material for substrate.
CONSTITUTION: A solder material for substrate selected from Ag-based solder material, Au-based solder material, Pd-based solder material, Pt-based solder material, etc., having a thickness of about 0.1mm and having cleaned surface is placed in a vacuum chamber. A bonding assistant component consisting of at least one kind of substance selected from Ti, Zr and Cr is evaporated by heating at 1800-2600°C with electron beam irradiation and uniformly deposited on at least a surface of the solder material for substrate in the form of uniformly dispersed particles having an average particle diameter of 0.01-5μm. The solder material for substrate is inserted between a ceramic member such as Al2O3 and a metallic member such as Ni-Fe alloy, placed in a vacuum chamber and heated in vacuum at a prescribed temperature to effect the soldering work and obtain a laminated product having high bonding strength.
OKAWA MIKIO
NIWA SHOJI
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