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Patent Searching and Data


Title:
SOLDERING METHOD AND LAMINATING BODY USED FOR ITS EXECUTION
Document Type and Number:
Japanese Patent JPS61259872
Kind Code:
A
Abstract:

PURPOSE: To perform a quick and sure soldering with small heat input by pressing to the soldering object the peripheral edge of the part of a laminating body to which a drilling is subjected and by melting a solder with the heat input to the part peering from the drilled part.

CONSTITUTION: The heat sink 2 is composed of the laminating body having the copper coating layer 22 by electrical plating on one side of an Al base metal 21 and plural claws 3, 3... for soldering are punched in advance on the bent part to be pressed. In case of soldering, a sheet 4 is melted by abutting the soldering iron to the solder sheet 4 peering from the hole 3a of the claw 3 after pressing the heat sink 2 via the solder sheet 4 onto a chasis 1. The necessary soldering is thus enabled to perform easily and quickly with small heat input.


Inventors:
SHIRAI HIDEAKI
HIROSE MICHIO
HAYATA SATORU
ISHIBASHI HIROSHI
Application Number:
JP10332685A
Publication Date:
November 18, 1986
Filing Date:
May 14, 1985
Export Citation:
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Assignee:
MITSUBISHI CABLE IND LTD
International Classes:
B23K1/19; B23K1/00; (IPC1-7): B23K1/12; B23K1/19
Domestic Patent References:
JPS559492U1980-01-22
Attorney, Agent or Firm:
Tono Kono