Title:
SOLDERING METHOD OF PRINTED BOARD
Document Type and Number:
Japanese Patent JPS60203357
Kind Code:
A
Abstract:
PURPOSE: To prevent generation of non-solder, lump solder, etc. by dipping the surface to be soldered of a printed board in rippled solder liquid.
CONSTITUTION: A printed board 4 of which the surface to be soldered is faced downward is dipped to the surface of a solder tank 1 and a fan mechanism 3 is driven. The projecting parts equal to the number of the blow ports of a wave former are generated on the surface of the solder tank 1 by the liquid flow formed by the wave former by which ripples are generated. The surface to be soldered of the board 4 is therefore dipped into the ripped solder liquid and generation of non-solder and lump solder is obviated.
Inventors:
TAKAHASHI TSUTOMU
Application Number:
JP6174184A
Publication Date:
October 14, 1985
Filing Date:
March 29, 1984
Export Citation:
Assignee:
YAESU MUSEN KK
International Classes:
B23K1/08; B23K3/06; H05K3/34; (IPC1-7): H05K3/34
Domestic Patent References:
| JPS583774A | 1983-01-10 |
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