To provide a soldering device for mounting an insertion-type electronic component on a substrate by using a lead-free soldering material, and a soldering method of the substrate excellent in the reliability of connection between the electronic component and the substrate by reducing the generation of lift-off and the generation of a shrinkage cavity.

A mounted board soldered in a flow furnace 100 is obtained in such a manner that the mounted board is heated in a reflow furnace 110 and the solder of a solder joint is melted again, and thereafter an entire body of the mounted board is heated and maintained (111) to a uniform temperature, and in this state, the entire body of the substrate is totally and simultaneously cooled quickly (112). Alternately, the mounted board carried to the reflow furnace from the flow furnace without being solidified is obtained in such a manner that the mounted board is heated in the reflow furnace and the solder of the solder joint is melted again, and thereafter the entire body of the mounted board is heated and maintained to a uniform temperature, and in this state, the entire body of the board is totally and simultaneously cooled quickly.

COPYRIGHT: (C)2009,JPO&INPIT