To provide a soldering method which can control the volume of solder for each soldering point and can attain a desired soldering volume in order to prevent a variation in printing volume, failure in shape, generation of blur, and wear of squeeze.

Solder pellets 8 are mounted together with surface mounting components 7 on a cream-soldered layer 8 which has been formed by printing on a land of a printed circuit board 2 or the like, and these pellets 8 are fused for a soldering purpose. Moreover, the solder pellet is manufactured as a pellet having the same composition as the solder in the cream-solder in the volume which is equal to the difference between the volume of solder in the cream- solder and the volume of solder required for each soldering point.