To provide a soldering pallet which improves repetitiveness of a soldering condition, obtains excellent solder wicking free of individual differences and performs flow soldering of high quality, and to provide a method of conveying a printed wiring board.

The soldering pellet includes: a soldering pellet body part 5 which includes a printed wiring board storage part 3 for horizontally storing a printed wiring board 2; and has an opening part 4 for exposing downward a soldering part of the printed wiring board 2, formed in the printed wiring board storage part 3; pellet width fine adjustment plates 7 disposed at both width-directional ends of the soldering pellet body part 5 and having edges 6 engaging with conveyor ratchets; and elastic support members 8 elastically supporting the pallet fine adjustment plates 7 along the width in a freely movable state relative to the soldering pallet body part 5.