To ensure required solder joint strength while preventing generation of a solder ball by minimizing displacement of a component to be mounted in a soldering structure where a circular component, or the like, is mounted by soldering using a land formed on a circuit board and in an electronic apparatus with the soldering structure.

A gear type land 30 has protrusions 32 formed radially on the outer periphery of a circular portion 31. The circular portion 31 has a diameter substantially equal to that of the circular seat 21 of a mounting component 20. The mounting component 20 is a spring type pin contact component. The spring type pin contact component 20 is a spring pin.