Title:
短パルスレーザを用いた固体材料切断方法およびシステム
Document Type and Number:
Japanese Patent JP2010536576
Kind Code:
A
Abstract:
A method of cutting a solid material using a pulsed laser includes providing a pulsed laser beam, selecting a target point in the solid material, focusing the pulsed laser beam on the solid material such that at the target point in the solid material the pulsed laser beam has at least the minimum energy density required to ablate the solid material, and effecting relative motion of the pulsed laser beam with respect to the solid material such that the pulsed laser beam traces a first path to form a scribe line in the solid material and then a second path to form a second scribe line in the solid material, wherein the first path and the second path are essentially parallel and the first and second scribe lines overlap to form a single cut line in the solid material.
Inventors:
Cosic-Williams, Ellen M
Application Number:
JP2010521028A
Publication Date:
December 02, 2010
Filing Date:
August 13, 2008
Export Citation:
Assignee:
CORNING INCORPORATED
International Classes:
B23K26/00; B23K26/36; B23K26/40
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma
Go Sakuma