固体撮像装置およびその製造方法、並びに電子機器

Title:

固体撮像装置およびその製造方法、並びに電子機器

Document Type and Number:

Japanese Patent JP7013209

Kind Code:

B2

Abstract:

There is provided an imaging device with a semiconductor substrate having a first side and a second side opposite the first side. A photoelectric conversion unit is on the first side of the semiconductor substrate. A multilayer wiring layer is on the second side of the semiconductor substrate. A through electrode extends between the photoelectric conversion unit and the multilayer wiring layer. The multilayer wiring layer includes a local wiring layer. A second end of the through electrode is in direct contact with the local wiring layer.

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Inventors:

Junpei Yamamoto
Takushi Shigetoshi
Takanobu Tada
Shimpei Fukuoka

Application Number:

JP2017217217A

Publication Date:

January 31, 2022

Filing Date:

November 10, 2017

Export Citation:

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Assignee:

Sony Semiconductor Solutions Corporation

International Classes:

H01L21/768; H01L27/146; H01L23/522; H04N5/369; H04N5/374

Domestic Patent References:

JP2015053296A
JP2006269923A
JP2016029731A
JP201512126A

Attorney, Agent or Firm:

Takashi Nishikawa
Yoshio Inamoto

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