Title:
SOLID STATE IMAGE SENSOR
Document Type and Number:
Japanese Patent JP3674777
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a size from being increased and to eliminate the inclination of an element or distance unevenness due to wire bonding.
SOLUTION: An intermediate spacer 21 is disposed between a signal processing element 3 and an imaging element 4, and a space for connecting a wire W can be formed on a terminal formed on a bonding region 3a of the element 3 by the thickness of the spacer 21. In this case, since the inclinations of the element 3 and the element 4 can be suppressed when the wire W is connected, flexibility can be incorporated in the combination of the elements vertically sequentially laminated and provided. Further, since the unevenness of the heights of the elements and the inclinations of the elements occurring when the elements are combined and disposed can be suppressed, the size can be reduced and accuracy can be enhanced.
Inventors:
Nishida Katsuyasu
Yusuke Goto
Yusuke Goto
Application Number:
JP2001290058A
Publication Date:
July 20, 2005
Filing Date:
September 21, 2001
Export Citation:
Assignee:
Sharp Corporation
Sharp Takaya Electronics Co., Ltd.
Sharp Takaya Electronics Co., Ltd.
International Classes:
H01L27/14; H01L21/52; H01L21/60; H01L25/065; H01L25/07; H01L25/18; H04N5/225; H04N5/335; H04N5/372; H04N5/374; (IPC1-7): H01L27/14; H01L21/52; H01L21/60; H01L25/065; H01L25/07; H01L25/18; H04N5/335
Domestic Patent References:
| JP2002354200A | ||||
| JP2000058743A | ||||
| JP11261044A | ||||
| JP2312265A |
Attorney, Agent or Firm:
Hidesaku Yamamoto
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