Title:
SOLID STATE IMAGE SENSOR
Document Type and Number:
Japanese Patent JPH01228178
Kind Code:
A
Abstract:
PURPOSE:To prevent a adhesive from being left unremoved on an image sensor mounting face and decrease the deviation between a photodetective face and the position of the focus of a camera by a method wherein the image sensor mounting face of a mounting base is made lower than a bonding plane of the mounting base where a transparent sealing cap is bonded. CONSTITUTION:A solid state image sensing element chip 3 mounted on a mounting face 2A of the surface of a mounting base 2 is sealed in a transparent sealing cap 4, and the transparent sealing cap 4 is fixed to a bonding face 2B of the surface of the mounting base 2 through adhesive 6. An image sensor mounting face 7 is provided on a peripheral part 2C of the surface of the mounting base 2, and the image sensor packaging face 7 is made, at least, lower than the bonding face 2B of the surface of the mounting base 2. By these processes, even if the transparent sealing cap 4 is positionally deviated at the bonding of it to the surface of the mounting base 2, the adhesive 6 is prevented from attaching to the image sensor mounting face 7, so that the deviation of a photodetecting face form the focus of a camera can be reduced.
Inventors:
AMATATSU HIROMI
ISHIOKA KATSUNORI
ISHIOKA KATSUNORI
Application Number:
JP5347588A
Publication Date:
September 12, 1989
Filing Date:
March 09, 1988
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/02; H01L23/10; H01L27/14; H01L31/02; H04N5/335; H04N5/369; H04N5/372; (IPC1-7): H01L23/02; H01L23/10; H01L27/14; H01L31/02; H04N5/335
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)
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