PURPOSE: To protect the solid-state image sensor from the outside atmosphere and secure its long life and high reliability and, at the same time, reduce the time required for making sealing work, by filling the space between the substrate and the transparent glass with a transparent resin hardened by ultraviolet rays.

CONSTITUTION: A solid image pickup element 2 is installed in the central depressed part of a substrated formed of a ceramic by diebonding and the solid image pickup element 2 is connected with a conductive lead 3 with a bonding wire 4. Then, an unhardened silicone plastic whose transparency is of solventless type and which is hardened by ultraviolet rays is charged into the depressed part of the substrate 1. When a ultraviolet ray passing glass plate 7 is put on the opening of the substrate and ultraviolet rays are irradiated upon the opening from a high pressure mercury vapor lamp, the unhardened resin charged into the depressed part is completely hardened by the ultraviolet rays and becomes a transparent ultraviolet ray hardened resin 12. As the result of this, each part contacting with the resin 12 gets a sufficient adhesive strength.