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Patent Searching and Data


Title:
SOLID-STATE IMAGING DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008205021
Kind Code:
A
Abstract:

To provide a solid-state imaging device for suppressing the deterioration of sensitivity with the miniaturization of a photodiode, while reducing a dark current.

A transfer gate part 16 composed of a gate insulating film 7 and a gate electrode 8 is formed above a charge storage part 3 which is formed by being embedded in a semiconductor substrate 1. A charge detecting part 10 is formed above the charge storage part 3 and on the surface of the semiconductor substrate 1 which is adjacent to one end of the transfer gate part. An embedded insulating film 9 is formed below the charge detecting part 10 and above the charge storage part 3 in the semiconductor substrate 1. The embedded insulating film 9 is formed in the semiconductor substrate 1 by extension to the lower region (a channel region) of the transfer gate part.


Inventors:
MATSUI YASUSHI
Application Number:
JP2007036608A
Publication Date:
September 04, 2008
Filing Date:
February 16, 2007
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L27/146; H04N5/335; H04N5/361; H04N5/369; H04N5/374
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura