Title:
SOLID STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME, AS WELL AS ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2022174486
Kind Code:
A
Abstract:
To enable the suppression of uneven reflection of incident light.SOLUTION: A solid state imaging device has an image sensor chip having a semiconductor substrate and a device chip bonded to a wiring layer on the opposite side of the semiconductor substrate from the light-entering side. The device chip is located in the pixel area of the image sensor chip, and the wiring layer of the image sensor chip has a dummy metal wiring in the area of the pixel area where the device chip is not located. This technology can be applied, for example, to a solid-state imaging device in which an image sensor chip and a device chip are bonded together.SELECTED DRAWING: Figure 1
Inventors:
OMORI HIROKI
FUJII NOBUTOSHI
FUJII NOBUTOSHI
Application Number:
JP2021080318A
Publication Date:
November 24, 2022
Filing Date:
May 11, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP
International Classes:
H01L27/146; H01L21/3205; H01L25/065; H04N5/369
Attorney, Agent or Firm:
Takashi Nishikawa
Yoshio Inamoto
Yusuke Miura
Yoshio Inamoto
Yusuke Miura